Multilayer
Multilayer printed circuits were conceived to cater to the rapid development of miniaturization technologies for electronic components and the consequent reduction in space.
| Materials used |
FR4 -Polymide (e/o Kapton)-Teflon-FR4 Medium/High TG |
|---|---|
| Laminate Thickness |
0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm |
| Copper Base Thick |
18 - 35 - 70 - 105 -140 - 200 µm |
| Surface Finishing |
OSP |
| Optional |
Blind Via Holes |
