Our production site will be closed for holidays from August 6th to August 24th inclusive.

Multilayer


Multilayer printed circuits were conceived to cater to the rapid development of miniaturization technologies for electronic components and the consequent reduction in space.

 

 

 

Materials used

FR4 -Polymide (e/o Kapton)-Teflon-FR4 Medium/High TG

Laminate Thickness

0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm

Copper Base Thick

18 - 35 - 70 - 105 -140 - 200 µm

Surface Finishing

OSP
Hot Air Levelling Lead Free or Sn/Pb
Chemical Gold (ENIG - ENIPIG - ASIG)
Electrolitical Gold
Chemical Silver
Chemical Tin

Optional

Blind Via Holes
Buried Via Holes
Plug-In on Holes
Carbon (for sliding contacts or membrane)
Print pelable solder resist

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