We inform our customers that our production plant will be closed for public holidays on December 7th and 8th.


Multilayer printed circuits were conceived to cater to the rapid development of miniaturization technologies for electronic components and the consequent reduction in space.




Materials used

FR4 -Polymide (e/o Kapton)-Teflon-FR4 Medium/High TG

Laminate Thickness

0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm

Copper Base Thick

18 - 35 - 70 - 105 -140 - 200 µm

Surface Finishing

Hot Air Levelling Lead Free or Sn/Pb
Chemical Gold (ENIG - ENIPIG - ASIG)
Electrolitical Gold
Chemical Silver
Chemical Tin


Blind Via Holes
Buried Via Holes
Plug-In on Holes
Carbon (for sliding contacts or membrane)
Print pelable solder resist

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