Double Layer

This technology is widely used to design printed circuit board in a variety of different electronics sectors.

 

  

Materials used

FR4 - CEM1 - CEM3 - Laminate HTC (High Thermal Conductivity) - Polymide (e/o Kapton) -Teflon - FR4 Medium/High TG - Laminate with CTI>250 (PLC<3)

Laminate Thickness

0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm

Copper Base Thick

18 - 35 - 70 - 105 -140 -200 µm

Surface Finishing

OSP
Hot Air Levelling Lead Free or Sn/Pb
Chemical Gold (ENIG - ENIPIG - ASIG)
Electrolitical Gold
Chemical Silver
Chemical Tin

Optional

Carbon (for sliding contacts or membrane)
Print pelable solder resist

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