Double Layer
This technology is widely used to design printed circuit board in a variety of different electronics sectors.
| Materials used |
FR4 - CEM1 - CEM3 - Laminate HTC (High Thermal Conductivity) - Polymide (e/o Kapton) -Teflon - FR4 Medium/High TG - Laminate with CTI>250 (PLC<3) |
|---|---|
| Laminate Thickness |
0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm |
| Copper Base Thick |
18 - 35 - 70 - 105 -140 -200 µm |
| Surface Finishing |
OSP |
| Optional |
Carbon (for sliding contacts or membrane) |
