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Aluminum


Printed circuit boards with new technology aimed at resolving problems associated with the dissipation of heat in electronic components, when the use of HTC materials is insufficient, and without the need to use additional dissipaters.

 

 

  

Materials used

IMS (Insulated Metallic Substrate)
DBC (Direct Bond Copper)

Laminate Thickness

0,6 - 0,8 - 1,0 - 1,5 - 2,0 - 2,4 - 3,2 mm

Copper Base Thick

35 - 70 - 105 -140 - 200 µm

Surface Finishing

OSP
Hot Air Levelling Lead Free or Sn/Pb
Chemical Gold (ENIG - ENIPIG - ASIG)
Electrolitical Gold
Chemical Silver
Chemical Tin

 

On Demand Service

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