We inform our customers that our production plant will be closed for public holidays on December 7th and 8th.


Printed circuit boards with new technology aimed at resolving problems associated with the dissipation of heat in electronic components, when the use of HTC materials is insufficient, and without the need to use additional dissipaters.




Materials used

IMS (Insulated Metallic Substrate)
DBC (Direct Bond Copper)

Laminate Thickness

0,6 - 0,8 - 1,0 - 1,5 - 2,0 - 2,4 - 3,2 mm

Copper Base Thick

35 - 70 - 105 -140 - 200 µm

Surface Finishing

Hot Air Levelling Lead Free or Sn/Pb
Chemical Gold (ENIG - ENIPIG - ASIG)
Electrolitical Gold
Chemical Silver
Chemical Tin


On Demand Service

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