Aluminium
Printed circuit boards with new technology aimed at resolving problems associated with the dissipation of heat in electronic components, when the use of HTC materials is insufficient, and without the need to use additional dissipaters.
| Materials used |
IMS (Insulated Metallic Substrate) |
|---|---|
| Laminate Thickness |
0,6 - 0,8 - 1,0 - 1,5 - 2,0 - 2,4 - 3,2 mm |
| Copper Base Thick |
35 - 70 - 105 -140 - 200 µm |
| Surface Finishing |
OSP |
