For Summer Holidays our production will be closed from August 2nd to August 23rd.

Aluminum


Printed circuit boards with new technology aimed at resolving problems associated with the dissipation of heat in electronic components, when the use of HTC materials is insufficient, and without the need to use additional dissipaters.

  

Materialien

IMS - DBC

Materialdicke

0,6 - 0,8 - 1,0 - 1,5 - 2,0 - 2,4 - 3,2 mm

Kupferdicke

35 - 70 - 105 -140 - 200 µm

Oberflächenbehandlung

OSP
Hot Air Levelling bleifrei or Sn/Pb
Chemisch Gold (ENIG - ENIPIG - ASIG)
Elektrolytisch Gold
Chemisch Silber
Chemisch Zinn

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