Aluminium
Printed circuit boards with new technology aimed at resolving problems associated with the dissipation of heat in electronic components, when the use of HTC materials is insufficient, and without the need to use additional dissipaters.
| Materialien |
IMS - DBC |
|---|---|
| Materialdicke |
0,6 - 0,8 - 1,0 - 1,5 - 2,0 - 2,4 - 3,2 mm |
| Kupferdicke |
35 - 70 - 105 -140 - 200 µm |
| Oberflächenbehandlung |
OSP |
